Related Books

3D Stacked Chips
Language: en
Pages: 339
Authors: Ibrahim (Abe) M. Elfadel, Gerhard Fettweis
Categories: Technology & Engineering
Type: BOOK - Published: 2016-05-11 - Publisher: Springer

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing
Coupled Data Communication Techniques for High-Performance and Low-Power Computing
Language: en
Pages: 206
Authors: Ron Ho, Robert Drost
Categories: Technology & Engineering
Type: BOOK - Published: 2010-06-03 - Publisher: Springer Science & Business Media

Wafer-scale integration has long been the dream of system designers. Instead of chopping a wafer into a few hundred or a few thousand chips, one would just connect the circuits on the entire wafer. What an enormous capability wafer-scale integration would offer: all those millions of circuits connected by high-speed
CHIPS 2020 VOL. 2
Language: en
Pages: 319
Authors: Bernd Höfflinger
Categories: Science
Type: BOOK - Published: 2015-09-19 - Publisher: Springer

The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore’s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance. At the same time, we are witnessing a data explosion in the
Design of 3D Integrated Circuits and Systems
Language: en
Pages: 324
Authors: Rohit Sharma
Categories: Technology & Engineering
Type: BOOK - Published: 2018-09-03 - Publisher: CRC Press

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D
Physical Design for 3D Integrated Circuits
Language: en
Pages: 397
Authors: Aida Todri-Sanial, Chuan Seng Tan
Categories: Technology & Engineering
Type: BOOK - Published: 2017-12-19 - Publisher: CRC Press

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits,